FLEX:Smart-AOI automated optical inspection

Programming with a pre-trained neural network and built-in library provides:

• Automatic programming for 90% of components.
• Automatic correction of inspection parameters taking into account the product class according to IPC-610.
• Reduced labor costs and reduced setup time.
• Reducing the number of false calls and missed defects.

The design of the inspection modules with four corner projectors, telecentric lenses and multi-level RGB illumination makes it possible to detect the maximum number of defects and ensure high quality 3D inspection of printed circuit boards.

Depending on the required tasks, the inspection modules can be equipped with telecentric lenses with a resolution of 8, 13 or 15 µm.

Software and hardware compatibility of paste inspection (SPI) and automated optical inspection (AOI) systems is ensured by their development on a single platform. This provides additional benefits for the customer in the operation and maintenance of the equipment.

Both systems are coordinated in terms of technical characteristics and functionality, which gives maximum inspection efficiency as part of one production line.

The stability and reliability of the designs of advanced systems as part of the FLEX:Smart-AOI complex allows you to achieve high inspection speeds:

• for the SPI system - 94 cm²/s;
• for the AOI system - 64 cm²/s.

The use of high-performance telecentric lenses makes it possible to fully inspect boards and solder points without compromising the performance of the SMT line.